Status Launched
Launch Date Q1'15
Processor Number i3-4170
Cache 3 MB
DMI2 5 GT/s
# of QPI Links 0
Instruction Set 64-bit
Instruction Set Extensions SSE4.1/4.2 AVX 2.0
Embedded Options Available No
Lithography 22 nm
Scalability 1S Only
Thermal Solution Specification PCG 2013C
Conflict Free Yes
Performance
# of Cores 2
# of Threads 4
Processor Base Frequency 3.7 GHz
TDP 54 W
Memory Specifications
Max Memory Size (dependent on memory type) 32 GB
Memory Types DDR3 and DDR3L 1333/1600 at 1.5V
Max # of Memory Channels 2
Max Memory Bandwidth 25.6 GB/s
ECC Memory Supported ‡ Yes
Graphics Specifications
Processor Graphics ‡ Intel® HD Graphics 4400
Graphics Base Frequency 350 MHz
Graphics Max Dynamic Frequency 1.15 GHz
Graphics Video Max Memory 1.7 GB
Intel® Quick Sync Video Yes
Intel® InTru™ 3D Technology Yes
Intel® Wireless Display Yes
Intel® Clear Video HD Technology Yes
# of Displays Supported ‡ 3
Expansion Options
PCI Express Revision 3.0
PCI Express Configurations ‡ Up to 1x16 2x8 1x8/2x4
Max # of PCI Express Lanes 16
Package Specifications
Max CPU Configuration 1
TCASE 72°C
Package Size 37.5mm x 37.5mm
Graphics and IMC Lithography 22 nm
Sockets Supported FCLGA1150
Low Halogen Options Available See MDDS
Advanced Technologies
Intel® Turbo Boost Technology ‡ No
Intel® vPro Technology ‡ No
Intel® Hyper-Threading Technology ‡ Yes
Intel® Virtualization Technology (VT-x) ‡ Yes
Intel® Virtualization Technology for Directed I/O (VT-d) ‡ No
Intel® VT-x with Extended Page Tables (EPT) ‡ Yes
Intel® TSX-NI No
Intel® 64 ‡ Yes
Idle States Yes
Enhanced Intel SpeedStep® Technology Yes
Thermal Monitoring Technologies Yes
Intel® Stable Image Platform Program (SIPP) No
Intel® Data Protection Technology
AES New Instructions Yes
Secure Key Yes
Intel® Platform Protection Technology
Trusted Execution Technology ‡ No
Execute Disable Bit ‡ Yes
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Launch Date Q1'15
Processor Number i3-4170
Cache 3 MB
DMI2 5 GT/s
# of QPI Links 0
Instruction Set 64-bit
Instruction Set Extensions SSE4.1/4.2 AVX 2.0
Embedded Options Available No
Lithography 22 nm
Scalability 1S Only
Thermal Solution Specification PCG 2013C
Conflict Free Yes
Performance
# of Cores 2
# of Threads 4
Processor Base Frequency 3.7 GHz
TDP 54 W
Memory Specifications
Max Memory Size (dependent on memory type) 32 GB
Memory Types DDR3 and DDR3L 1333/1600 at 1.5V
Max # of Memory Channels 2
Max Memory Bandwidth 25.6 GB/s
ECC Memory Supported ‡ Yes
Graphics Specifications
Processor Graphics ‡ Intel® HD Graphics 4400
Graphics Base Frequency 350 MHz
Graphics Max Dynamic Frequency 1.15 GHz
Graphics Video Max Memory 1.7 GB
Intel® Quick Sync Video Yes
Intel® InTru™ 3D Technology Yes
Intel® Wireless Display Yes
Intel® Clear Video HD Technology Yes
# of Displays Supported ‡ 3
Expansion Options
PCI Express Revision 3.0
PCI Express Configurations ‡ Up to 1x16 2x8 1x8/2x4
Max # of PCI Express Lanes 16
Package Specifications
Max CPU Configuration 1
TCASE 72°C
Package Size 37.5mm x 37.5mm
Graphics and IMC Lithography 22 nm
Sockets Supported FCLGA1150
Low Halogen Options Available See MDDS
Advanced Technologies
Intel® Turbo Boost Technology ‡ No
Intel® vPro Technology ‡ No
Intel® Hyper-Threading Technology ‡ Yes
Intel® Virtualization Technology (VT-x) ‡ Yes
Intel® Virtualization Technology for Directed I/O (VT-d) ‡ No
Intel® VT-x with Extended Page Tables (EPT) ‡ Yes
Intel® TSX-NI No
Intel® 64 ‡ Yes
Idle States Yes
Enhanced Intel SpeedStep® Technology Yes
Thermal Monitoring Technologies Yes
Intel® Stable Image Platform Program (SIPP) No
Intel® Data Protection Technology
AES New Instructions Yes
Secure Key Yes
Intel® Platform Protection Technology
Trusted Execution Technology ‡ No
Execute Disable Bit ‡ Yes
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Технически характеристики
| Серия: | Intel Core i3 |
|---|---|
| Поколение: | Intel Gen 4 |
| Процесор сокет: | LGA1150 |
| Брой ядра: | 2 ядрен |
| Архитектура: | 32/64 |
| Термична мощност (TDP): | 54 W |
| Видеокарта: | Да |
| Честота процесор: | 3700 MHz |
| Охладител: | Не |
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