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X570 AORUS XTREME

AMD X570 AORUS Motherboard with Direct 16 Phases Infineon Digital VRM, Fins-Array Heatsink, NanoCarbon Baseplate, Triple PCIe 4.0 M.2 with Thermal Guards, Intel^® WiFi 6 802.11ax, ESS SABRE HiFi 9218, AQUANTIA^® 10GbE LAN+1GbE LAN, RGB FAN COMMANDER, RGB Fusion 2.0

Supports AMD Ryzen™ 5000 Series / 3rd Gen Ryzen™/ 2nd Gen Ryzen™/ 2nd Gen Ryzen™ with Radeon™ Vega Graphics/ Ryzen™ with Radeon™ Vega Graphics Processors
Thermal Reactive Armor Design with Fins-Array Heatsink, Direct Touch Heatpipe and NanoCarbon Baseplate
Exclusive RGB FAN COMMANDER for Professional Casemoders
Dual Channel ECC/ Non-ECC Unbuffered DDR4, 4 DIMMs
Direct 16 Phases Infineon Digital VRM Solution with 70A Power Stage
Triple Ultra-Fast NVMe PCIe 4.0/3.0 x4 M.2 with Triple Thermal Guards
Onboard Intel^® WiFi 6 802.11ax 2T2R & BT 5 with 2X AORUS Antenna
Rear 130dB SNR AMP-UP Audio with ALC1220-VB & ESS SABRE 9218 DAC with WIMA Audio Capacitors
RGB FUSION with Multi-Zone Addressable LED Light Show Design, Support Addressable LED & RGB LED Strips
AQUANTIA^® 10GbE BASE-T LAN + Intel^® Gigabit LAN with cFosSpeed
USB TurboCharger for Mobile Device Fast Charge Support
Smart Fan 5 Features Multiple Temperature Sensors , Hybrid Fan Headers with FAN STOP and Noise Detection
Front & Rear USB 3.2 Gen 2 Type-C™ Headers
Q-Flash Plus Update BIOS Without Installing CPU, Memory and Graphics Card

Definitive Aesthetics

GIGABYTE ID team designs X570 AORUS XTREME from the drawing board. After countless hours of conceptualizing ideas, fine tuning details and engaging in discussion, GIGABYTE has produced a board that is equal parts beast and beauty.

HIFI AUDIO SYSTEM

Hi-Fi Audio System- As a Built-in Sound Card

For Hi-Fi Audio Solution, can be grouped into 2 parts.
Audio Signal Process, not distorted digital signal go through ESS 9218 Sabre DAC for Digital/Analog converter with 130dB SNR, 112dB THD+N and supports higher impedance up to 600 Ω headphone. Further, audiophile grade capacitor and gold plated audio jack ensures the non-compensated audio performance. Audio Signal Optimization, TXC Oscillator provides precise time triggers to Digital-Analog Converters. WIMA Capacitors to deliver crystal and balanced sound.

CPU
1. AMD Socket AM4, support for : AMD Ryzen™ 5000 Series / 3rd Generation AMD Ryzen™ processors/ 2nd Generation AMD Ryzen™ processors/ 2nd Generation AMD Ryzen™ with Radeon™ Vega Graphics processors/ AMD Ryzen™ with Radeon™ Vega Graphics processors
Chipset
1. AMD X570
Memory
1. AMD Ryzen™ 5000 series processors:
  Support for DDR4 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) / 3200 / 2933 / 2667 / 2400 / 2133 MHz memory modules
2. 3rd Generation AMD Ryzen™ processors:
  Support for DDR4 4400(O.C.) / 4300(O.C.) / 4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) / 3200 / 2933 / 2667 / 2400 / 2133 MHz memory modules
3. 2nd Generation AMD Ryzen™ processors/2nd Generation AMD Ryzen™ with Radeon™ Vega Graphics processors/AMD Ryzen™ with Radeon™ Vega Graphics processors:
  Support for DDR4 3600(O.C.) / 3400(O.C.) / 3333(O.C.) / 3200(O.C.) / 2933 / 2667 / 2400 / 2133 MHz memory modules
4. 4 x DDR4 DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory
5. Dual channel memory architecture
6. Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules*
  * ECC mode supported by 3rd Gen AMD Ryzen™/ 2nd Gen AMD Ryzen™ and only PRO sku of 2nd Gen AMD Ryzen™ with Radeon™ Vega Graphics processors/ AMD Ryzen™ with Radeon™ Vega Graphics processors.
7. Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules
8. Support for Extreme Memory Profile (XMP) memory modules
Audio
1. Realtek^® ALC1220-VB codec
  * The front panel line out jack supports DSD audio.
2. ESS SABRE9218 DAC chip
3. High Definition Audio
4. 2/4/5.1/7.1-channel
5. Support for S/PDIF Out
LAN
1. 1 x Aquantia GbE LAN chip (10 Gbit/5 Gbit/2.5 Gbit/1000 Mbit/100 Mbit) (LAN1)
2. 1 x Intel^® GbE LAN phy (10/100/1000 Mbit) (LAN2)
Wireless Communication module
1. Wi-Fi 802.11a/b/g/n/ac/ax, supporting 2.4/5 GHz Dual-Band
2. BLUETOOTH 5.0
3. Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate
  * Actual data rate may vary depending on environment and equipment.
Expansion Slots
Integrated in the CPU (PCIEX16/PCIEX8):
1. 3rd Generation AMD Ryzen™ processors:
  1 x PCI Express x16 slot, supporting PCIe 4.0 and running at x16 (PCIEX16)
  1 x PCI Express x16 slot, supporting PCIe 4.0 and running at x8 (PCIEX8)
2. 2nd Generation AMD Ryzen™ processors:
  1 x PCI Express x16 slot, supporting PCIe 3.0 and running at x16 (PCIEX16)
  1 x PCI Express x16 slot, supporting PCIe 3.0 and running at x8 (PCIEX8)
  * For optimum performance, if only one PCI Express graphics card is to be installed, be sure to install it in the PCIEX16 slot.
  * The PCIEX8 slot shares bandwidth with the PCIEX16 slot. When using the 3rd Generation AMD Ryzen™ processors/2nd Generation AMD Ryzen™ processors and PCIEX8 slot is populated, the PCIEX16 slot operates at up to x8 mode.
3. 2nd Generation AMD Ryzen™ with Radeon™ Vega Graphics processors/AMD Ryzen™ with Radeon™ Vega Graphics processors:
  1 x PCI Express x16 slot, supporting PCIe 3.0 and running at x8 (PCIEX16)
Integrated in the Chipset (PCIEX4):
1. 1 x PCI Express x16 slot, supporting PCIe 4.0*/3.0 and running at x4
  * For 3rd Generation AMD Ryzen™ processors only.
Multi-Graphics Technology
1. Support for NVIDIA^® Quad-GPU SLI™ and 2-Way NVIDIA^® SLI™ technologies
2. Support for AMD Quad-GPU CrossFire™ and 2-Way AMD CrossFire™ technologies
* For 3rd Generation AMD Ryzen™ processors/2nd Generation AMD Ryzen™ processors only.
Storage Interface
Integrated in the CPU (M2A_SOCKET):
1. 3rd Generation AMD Ryzen™ processors:
  1 x M.2 connector (Socket 3, M key, type 2242/2260/2280/22110 SATA and PCIe 4.0 x4/x2 SSD support)
2. 2nd Generation AMD Ryzen™ processors/2nd Generation AMD Ryzen™ with Radeon™ Vega Graphics processors/AMD Ryzen™ with Radeon™ Vega Graphics processors:
  1 x M.2 connector (Socket 3, M key, type 2242/2260/2280/22110 SATA and PCIe 3.0 x4/x2 SSD support)
Integrated in the Chipset (M2B_SOCKET/M2C_SOCKET):
1. 1 x M.2 connector (Socket 3, M key, type 2242/2260/2280/22110 SATA and PCIe 4.0*/3.0 x4/x2 SSD support) (M2B_SOCKET)
  * For 3rd Generation AMD Ryzen™ processors only.
2. 1 x M.2 connector (Socket 3, M key, type 2242/2260/2280/22110 SATA and PCIe 4.0*/3.0 x4/x2 SSD support) (M2C_SOCKET)
  * For 3rd Generation AMD Ryzen™ processors only.
3. 6 x SATA 6Gb/s connectors
4. Support for RAID 0, RAID 1, and RAID 10
USB
Integrated in the CPU:
1. 2 x USB 3.2 Gen 2*/Gen 1 Type-A ports (red) on the back panel
  * For 3rd Generation AMD Ryzen™ processors only.
2. 2 x USB 3.2 Gen 1 ports on the back panel
Integrated in the Chipset:
1. 1 x USB Type-C™ port with USB 3.2 Gen 2 support, available through the internal USB header
2. 1 x USB Type-C™ port on the back panel, with USB 3.2 Gen 2 support
3. 3 x USB 3.2 Gen 2 Type-A port (red) on the back panel
4. 2 x USB 3.2 Gen 1 ports available through the internal USB header
Chipset+USB 3.2 Gen 1 Hub:
1. 2 x USB 3.2 Gen 1 ports available through the internal USB header
2. 2 x USB 2.0/1.1 ports available through the internal USB header
Chipset+USB 2.0 Hub:
1. 4 x USB 2.0/1.1 ports on the back panel
Internal I/O Connectors
1. 1 x 24-pin ATX main power connector
2. 2 x 8-pin ATX 12V power connectors
3. 1 x OC PEG power connector
4. 1 x CPU fan header
5. 1 x water cooling CPU fan header
6. 4 x system fan headers
7. 2 x system fan/water cooling pump headers
8. 2 x addressable LED strip headers
9. 2 x RGB LED strip headers
10. 3 x M.2 Socket 3 connectors
11. 6 x SATA 6Gb/s connectors
12. 1 x front panel header
13. 1 x front panel audio header
14. 1 x USB Type-C™ port, with USB 3.2 Gen 2 support
15. 2 x USB 3.2 Gen 1 headers
16. 1 x USB 2.0/1.1 header
17. 1 x noise detection header
18. 1 x Trusted Platform Module (TPM) header (2x6 pin, for the GC-TPM2.0_S module only)
19. 2 x temperature sensor headers
20. 1 x power button
21. 1 x reset button
22. 2 x BIOS switches
23. Voltage Measurement Points
＊All fan headers are subject to support AIO_Pump, Pump and high performance fan with the capability of delivering up to 2A/12V @ 24W.
Back Panel Connectors
1. 1 x Q-Flash Plus button
2. 1 x Clear CMOS button
3. 2 x SMA antenna connectors (2T2R)
4. 1 x USB Type-C™ port, with USB 3.2 Gen 2 support
5. 2 x USB 3.2 Gen 2*/Gen 1 Type-A ports (red)
  * For 3rd Generation AMD Ryzen™ processors only.
6. 3 x USB 3.2 Gen 2 Type-A ports (red)
7. 2 x USB 3.2 Gen 1 ports
8. 4 x USB 2.0/1.1 ports
9. 2 x RJ-45 ports
10. 1 x optical S/PDIF Out connector
11. 5 x audio jacks
I/O Controller
1. iTE^® I/O Controller Chip
H/W Monitoring
1. Voltage detection
2. Temperature detection
3. Fan speed detection
4. Water cooling flow rate detection
5. Overheating warning
6. Fan fail warning
7. Fan speed control
  * Whether the fan (pump) speed control function is supported will depend on the fan (pump) you install.
8. Noise detection
BIOS
1. 2 x 128 Mbit flash
2. Use of licensed AMI UEFI BIOS
3. Support for DualBIOS™
4. PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0
Unique Features
1. Support for APP Center
  * Available applications in APP Center may vary by motherboard model. Supported functions of each application may also vary depending on motherboard specifications.
  @BIOS
  EasyTune
  Fast Boot
  Game Boost
  RGB Fusion
  Smart Backup
  System Information Viewer
  USB TurboCharger
2. Support for Q-Flash Plus
3. Support for Q-Flash
4. Support for Xpress Install
Operating System
1. Support for Windows 10 64-bit
Form Factor
1. E-ATX Form Factor; 30.5cm x 27.0cm

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Технически характеристики

Процесор сокет:	AM4
Чипсет:	X570
Поддържана памет:	DDR4
Брой слотове за RAM памет:	4
Storage интерфейси:	SATA 6Gbit/s, M.2
RAID:	Да
Безжични мрежи:	802.11ax
Bluetooth:	Да
Видео слот:	PCI-E
Multi-Graphics технология:	CrossFire & SLI
Видео изход:	Няма
Форм фактор:	E-ATX
Видеокарта:	Няма