Name: Дънна платка Gigabyte B660M DS3H DDR4, B660, LGA 1700, DDR4, PCI-E 4.0, (DP&HDMI&VGA), 4x SATA 6Gb/s, 2x M.2, 3x USB 3.2 Gen 1, mATX
Brand: Gigabyte
SKU: MBIGIGABYTEGBB660MDS3HDDR4
Price: 231.53 BGN
Availability: InStock

Описание Характеристики Ревюта / Въпроси

Gigabyte B660M DS3H DDR4

Cleaner and more efficient power delivery to the CPU with better thermal performance ensure stability under high CPU frequencies and heavy loading.

6+2+1 Phases Low RDS(on) MOSFETs
Solid capacitors to improve transient response and minimize oscillation
8-pin Solid Pin CPU Power Connector

M.2 Thermal Guard
GIGABYTE Ultra-Efficient M.2 Thermal Guard
With durability in mind, GIGABYTE provides a thermal solution for M.2 SSD devices. The M.2 Thermal Guard prevents throttling and bottlenecks from high speed M.2 SSDs as it helps to dissipate heat before it becomes an issue.

Specifications:

CPU
1. LGA1700 socket: Support for 12th Generation Intel^® Core™, Pentium^® Gold and Celeron^® Processors*
2. L3 cache varies with CPU
Chipset
1. Intel^® B660 Express Chipset
Memory
1. Support for DDR4 5333(O.C.)/ DDR4 5133(O.C.)/DDR4 5000(O.C.)/4933(O.C.)/4800(O.C.)/ 4700(O.C.)/ 4600(O.C.)/ 4500(O.C.)/ 4400(O.C.)/ 4300(O.C.)/4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3666(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) / 3200/3000/2933/2666/2400/2133 MHz memory modules
2. 4 x DDR DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory
3. Dual channel memory architecture
4. Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode)
5. Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules
6. Support for Extreme Memory Profile (XMP) memory modules
Onboard Graphics
Integrated Graphics Processor-Intel^® HD Graphics support:
1. 1 x D-Sub port, supporting a maximum resolution of 1920x1200@60 Hz
2. 1 x HDMI port, supporting a maximum resolution of 4096x2160@60 Hz
  * Support for HDMI 2.1 version and HDCP 2.3.
  ** Support native HDMI 2.1 TMDS compatible ports.
3. 1 x DisplayPort, supporting a maximum resolution of 4096x2304@60 Hz
  * Support for DisplayPort 1.2 version and HDCP 2.3
4. 1 x DisplayPort, supporting a maximum resolution of 4096x2304@60 Hz
  * Support for DisplayPort 1.2 version.
(Graphics specifications may vary depending on CPU support.)

Support for up to 4 displays at the same time
Audio
1. Realtek^® Audio CODEC
2. High Definition Audio
3. 2/4/5.1/7.1-channel
  * To configure 7.1-channel audio, you need to open the audio software and select Device advanced settings > Playback Device to change the default setting first.
LAN
1. Realtek^® 2.5GbE LAN chip (2.5 Gbps/1 Gbps/100 Mbps)
Expansion Slots
1. 1 x PCI Express x16 slot, running at x16
  (The PCIEX16 slot conforms to PCI Express 4.0 standard.)
2. 2 x PCI Express x1 slots
  (The PCIEX1 slots conform to PCI Express 3.0 standard.)
Storage Interface
CPU:
1. 1 x M.2 connector (Socket 3, M key, type 2260/2280 PCIe 4.0 x4/x2 SSD support) (M2A_CPU)
Chipset:
1. 1 x M.2 connector (Socket 3, M key, type 2260/2280 PCIe 4.0 x4/x2 SSD support) (M2P_SB)
2. 4 x SATA 6Gb/s connectors
Support for RAID 0, RAID 1, RAID 5, and RAID 10

Intel^® Optane™ Memory Ready
* System acceleration with Intel^® Optane™ Memory can only be enabled on the M.2 connector supported by the Chipset.
USB
Chipset:
1. 1 x USB Type-C^® port on the back panel, with USB 3.2 Gen 2 support
2. 5 x USB 3.2 Gen 1 ports (3 ports on the back panel, 2 ports available through the internal USB header)
3. 2 x USB 2.0/1.1 ports on the back panel
Chipset+2 USB 2.0 Hubs:
1. 4 x USB 2.0/1.1 ports available through the internal USB headers
Internal I/O Connectors
1. 1 x 24-pin ATX main power connector
2. 1 x 8-pin ATX 12V power connector
3. 1 x CPU fan header
4. 3 x system fan headers
5. 1 x addressable LED strip header
6. 1 x RGB LED strip header
7. 2 x M.2 Socket 3 connectors
8. 4 x SATA 6Gb/s connectors
9. 1 x front panel header
10. 1 x front panel audio header
11. 1 x USB 3.2 Gen 1 header
12. 2 x USB 2.0/1.1 headers
13. 1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 module only)
14. 1 x serial port header
15. 1 x parallel port header
16. 1 x S/PDIF Out header
17. 1 x Q-Flash Plus button
18. 1 x reset button
19. 1 x reset jumper
20. 1 x Clear CMOS jumper
＊All fan headers are subject to support AIO_Pump, Pump and high performance fan with the capability of delivering up to 2A/12V @ 24W.
Back Panel Connectors
1. 2 x USB 2.0/1.1 ports
2. 1 x PS/2 keyboard/mouse port
3. 1 x D-Sub port
4. 1 x HDMI port
5. 2 x DisplayPorts
6. 3 x USB 3.2 Gen 1 ports
7. 1 x USB Type-C^® port, with USB 3.2 Gen 2 support
8. 1 x RJ-45 port
9. 3 x audio jacks
I/O Controller
1. iTE^® I/O Controller Chip
H/W Monitoring
1. Voltage detection
2. Temperature detection
3. Fan speed detection
4. Fan fail warning
5. Fan speed control
  * Whether the fan speed control function is supported will depend on the cooler you install.
BIOS
1. 1 x 256 Mbit flash
2. Use of licensed AMI UEFI BIOS
3. PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0
Unique Features
1. Support for APP Center
  * Available applications in APP Center may vary by motherboard model. Supported functions of each application may also vary depending on motherboard specifications.
  @BIOS
  EasyTune
  Fast Boot
  Game Boost
  ON/OFF Charge
  RGB Fusion
  Smart Backup
  System Information Viewer
2. Support for Q-Flash Plus
3. Support for Q-Flash
4. Support for Xpress Install
Operating System
1. Support for Windows 11 64-bit
2. Support for Windows 10 64-bit
Form Factor
1. Micro ATX Form Factor; 24.4cm x 24.4cm

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Технически характеристики

Процесор сокет:	LGA 1700
Чипсет:	B660
Поддържана памет:	DDR4
Брой слотове за RAM памет:	4
Storage интерфейси:	SATA 6Gbit/s, M.2
RAID:	Да
Безжични мрежи:	Не
Bluetooth:	Не
Видео слот:	PCI-E
Multi-Graphics технология:	Няма
Видео изход:	DP HDMI (D-Sub)
Форм фактор:	Micro ATX